PCB Assembly 4-in-1 Turnkey Service

 

You don't need to shop around to find supplier A for bare board PCB, supplier B for solder stencil, supplier C for components and supplier D for PCB assembly. E-TekNet will do every thing for you and combines all of four services into one single service and save your valuable time and money! It is very important that you should send us the BOM ASAP if you enter "Yes" in the quote form field of (Do you want E-TekNet to purchase all of components for you). We will send you the quote for the components in average 2 days. We provide both full turnkey service or partial turnkey service at your choice.

For turnkey quote your BOM should include:
(1) Quantity for each part
(2) Reference designator
(3) Distributor or manufacturer part number
(4) Part description
(5) Package type and size

Our Capability on PCB Assembly


 

Please check PCB Glossary for reference. Please contact us if you have a special requirement not listed in the following table.

Feature Capability
Minimum passive component size 0201
Minimum pitch size on BGA components 0.4 mm
Parts procurement Kitted or turnkey
Solder types Tin/lead reflow or lead free RoHS compliant reflow
Conformal coating Yes
Stainless solder steel stencil Frameless or framed.
Functional test after assembly Yes. Need customer to send over test firxture or test design.

*Definition for standard features for PCB assembly : Minimum passive component size 0603, Minimum BGA pitch size 1.0 mm, parts received on 2nd day after order is received, lead time is 15 business day or longer

*Definition for nonstandard features for PCB assembly : Any features not listed on above definition are non-standard features

Our Capability on Bare Board PCB


 

Please check PCB Glossary for reference. Please contact us if you have a special requirement not listed in the following table.

Feature Capability
Maximum Board Layers Up to 18 layers
Maximum Board size 25" x 17"
Board thickness (multilayer board) Maximum:0.13" (any layers) ;   Minimum: 0.025" (4 layer)
Board thickness (1 or 2 layer board) 0.02",  0.031",  0.039",  0.047",  0.062",  0.078",  0.094",  0.118", 0.125"
Tolerance of board thickness +/- 10%
Base materials FR-4, FR-406 (Tg 150 deg C), FR-408(Tg 170 deg C), G10, CEM3, Rogers, alumina ceramic
Copper weight and minimum trace width/space required 0.5 oz (min. trace width/space 4 mil), 1 oz (min. trace width/space 5 mil), 2 oz (min. trace width/space 7 mil), 4 oz (min. trace width/space 12 mil), 6 oz (min. trace width/space 20 mil), 8 oz (min. trace width/space 40 mil)
Minimum conductor width and space 0.003" (0.075 mm) for conductors including trace and annular ring
Minimum finished hole size 0.006" (0.15mm).  (Please see our drill sizes in stock)
Silkscreen/Legend colors white, yellow, black, pink, red
Solder Mask (LPI) Colors: Green, Black, Red, Blue, Purple, Yellow, Silver, Gold
Maximum hole aspect ratio 10:1
Surface plating Tin/Lead HAL, immersion gold (soft gold), electrolytic gold (hard gold), immersion tin, immersion silver, OSP
Gold finger Electrolytic gold on nickel: Max gold thickness 1.25 mm (30 micro-inches)
Blind/buried vias Yes

*Definition for standard features for bare board PCB : Finished PCB thickness 0.062", FR4 material, 1 oz finished copper thickness, minimum conductor width/space >= 6 mil, , minimum annular ring >= 6 mil, minimum finished hole size >=12 mil.  HASL Tin-lead or HASL Lead free, green LPI soldermask,  white silkscreen, minimum board size 1 inch on either width or length, maximum board size 12 inches on either width or length.

*Definition for nonstandard features for bare board PCB: Any features not listed on above definition are non-standard features